Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741448 | Method of singulating semiconductor die and method of fabricating semiconductor package | Byong-gook Jeong, Byung Ho Kim, Youn-jo Mun, Jeong-cheol An, Sung-Il Cho +1 more | 2020-08-11 |
| 7452753 | Method of processing a semiconductor wafer for manufacture of semiconductor device | Jae Hong Kim, Heui-Seog Kim, Jong-Keun Jeon, Wha-Su Sin | 2008-11-18 |