Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741448 | Method of singulating semiconductor die and method of fabricating semiconductor package | Byong-gook Jeong, Byung Ho Kim, Jeong-cheol An, Sung-Il Cho, Dae-sang Chun +1 more | 2020-08-11 |
| 9500599 | Surface inspection apparatus for semiconductor chips | Hoon Sohn, Sang-Young Kim, Yun-Kyu An, Sung-Il Cho, Seung-Weon Ha +2 more | 2016-11-22 |