Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10679972 | Method of manufacturing multi-chip package | Won-Gil Han, Byong-Joo Kim, Yong Je Lee, Jae-heung Lee | 2020-06-09 |
| 10147706 | Multi-chip package and method of manufacturing the same | Won-Gil Han, Byong-Joo Kim, Yong Je Lee, Jae-heung Lee | 2018-12-04 |
| 9500599 | Surface inspection apparatus for semiconductor chips | Youn-jo Mun, Hoon Sohn, Sang-Young Kim, Yun-Kyu An, Sung-Il Cho +2 more | 2016-11-22 |
| 8245902 | Wire bonding apparatus and method using the same | Yong Je Lee, Won-Gil Han | 2012-08-21 |