Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410990 | Jig for bonding a semiconductor chip, apparatus for bonding a semiconductor chip including the jig, and method of bonding a semiconductor chip using the apparatus | Man-hee Han, Sung-Il Cho, Jung Lae Jung | 2019-09-10 |
| 8956923 | Methods of fabricating semiconductor devices and underfill equipment for the same | Young-Ja Kim, Jun-Young Ko, Dae-Young Jeong | 2015-02-17 |
| 7863161 | Method of cutting a wafer | Jun-Young Ko, Wha-Su Sin, Jae-Yong Park | 2011-01-04 |
| 7745932 | Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same | Jun-Young Ko, Jae-Yong Park, Heui-Seog Kim, Wha-Su Sin | 2010-06-29 |
| 7713788 | Method of manufacturing semiconductor package using redistribution substrate | Jun-Young Ko, Heui-Seog Kim, Wha-Su Sin, Jae-Yong Park | 2010-05-11 |
| 7696615 | Semiconductor device having pillar-shaped terminal | Jun-Young Ko, Wha-Su Sin | 2010-04-13 |
| 7591714 | Wafer grinding and tape attaching apparatus and method | Jun-Young Ko, Sang Jun Kim | 2009-09-22 |