Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11244840 | Die ejectors and die supplying apparatuses including ihe same | Bub-ryong Lee, Sung-hyeon Park | 2022-02-08 |
| 10900883 | Mold test apparatus and method | Tea-Geon Kim | 2021-01-26 |
| 10833046 | Stack tool for reflow and stack apparatus having the same | Tea-Geon Kim, Bub-ryong Lee | 2020-11-10 |
| 10748855 | Laminating device and method for fabricating semiconductor package using the same | Tea-Geon Kim | 2020-08-18 |
| 10741430 | Stack boat tool and method using the same | Tea-Geon Kim | 2020-08-11 |
| 10410990 | Jig for bonding a semiconductor chip, apparatus for bonding a semiconductor chip including the jig, and method of bonding a semiconductor chip using the apparatus | Man-hee Han, Dae-Sang Chan, Sung-Il Cho | 2019-09-10 |