Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9705041 | Light emitting device packages and methods of forming the same | Dong Hyun Cho, Jong Rak Sohn, Yong Min KWON | 2017-07-11 |
| 9391250 | Electronic device package and package substrate for the same | Min Young Son, Yong Min KWON, Hak Hwan Kim | 2016-07-12 |
| 9136260 | Method of manufacturing chip-stacked semiconductor package | Jung-Seok Ahn, Dong-Hyeon Jang, Ho-Geon Song, Chang-Seong Jeon, Teak-Hoon Lee +1 more | 2015-09-15 |
| 9059149 | Electronic device package and packaging substrate for the same | Yong Min KWON, Seo Hyun Moon, Min Young Son | 2015-06-16 |
| 8637350 | Method of manufacturing chip-stacked semiconductor package | Jung-Seok Ahn, Dong-Hyeon Jang, Ho-Geon Song, Chang-Seong Jeon, Teak-Hoon Lee +1 more | 2014-01-28 |
| 8637969 | Stacked chips in a semiconductor package | Teak-Hoon Lee, Won Keun Kim, Dong-Hyeon Jang, Ho-Geon Song | 2014-01-28 |
| 8455301 | Method of fabricating stacked chips in a semiconductor package | Teak-Hoon Lee, Won Keun Kim, Dong-Hyeon Jang, Ho-Geon Song | 2013-06-04 |
| 7800138 | Semiconductor device including thermally dissipating dummy pads | Joong-Hyun Baek | 2010-09-21 |