Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368119 | Semiconductor package | Minki Kim, Won-Il Lee | 2025-07-22 |
| 12347819 | Semiconductor package having stacked semiconductor chips | Aenee Jang | 2025-07-01 |
| 12154881 | Integrated circuit device having redistribution pattern | Yunrae Cho, Jinyeol Yang, Jungmin Ko | 2024-11-26 |
| 12125753 | Semiconductor package including test bumps | Taehyeong Kim, Hyeongmun Kang | 2024-10-22 |
| 11721604 | Semiconductor package | Dongjoo CHOI, Youngdeuk Kim | 2023-08-08 |
| 11721601 | Semiconductor package and method of manufacturing the same | Hyeongmun Kang, Jungmin Ko, Taehyeong Kim, Insup Shin | 2023-08-08 |
| 11640951 | Integrated circuit device having redistribution pattern | Yunrae Cho, Jinyeol Yang, Jungmin Ko | 2023-05-02 |
| 11495576 | Semiconductor package | Kyoungsoo Kim, Sunwon Kang, Ho-Geon Song, Kyung Suk Oh | 2022-11-08 |
| 11488894 | Semiconductor device having planarized passivation layer and method of fabricating the same | Young Lyong Kim | 2022-11-01 |
| 11257725 | Semiconductor package including test bumps | Taehyeong Kim, Hyeongmun Kang | 2022-02-22 |
| 10847447 | Semiconductor device having planarized passivation layer and method of fabricating the same | Young Lyong Kim | 2020-11-24 |
| 9646895 | Semiconductor package and manufacturing method thereof | Ji Hwang Kim, Taeje Cho | 2017-05-09 |
| 9165916 | Semiconductor package and method of fabricating the same | Hyunsoo Chung, In-Young Lee, Tae-Je Cho | 2015-10-20 |