Patents per Year
Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347819 | Semiconductor package having stacked semiconductor chips | Seungduk Baek | 2025-07-01 |
| 12341074 | Semiconductor package with increased thermal dissipation | Younglyong Kim, Myungkee Chung | 2025-06-24 |
| 12237290 | Semiconductor packages and methods of manufacturing the semiconductor packages | Younglyong Kim | 2025-02-25 |
| 12191238 | Semiconductor package | — | 2025-01-07 |
| 11862613 | Semiconductor package | — | 2024-01-02 |
| 11810898 | Semiconductor package and method of manufacturing semiconductor package | — | 2023-11-07 |
| 11600601 | Semiconductor package | — | 2023-03-07 |
| 11594516 | Semiconductor package and method of manufacturing semiconductor package | — | 2023-02-28 |
| 11581248 | Semiconductor package | — | 2023-02-14 |
| 11581234 | Semiconductor package with improved heat dissipation | Younglyong Kim, Myungkee Chung | 2023-02-14 |