Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341074 | Semiconductor package with increased thermal dissipation | Younglyong Kim, Aenee Jang | 2025-06-24 |
| 12166013 | Semiconductor package, and a package on package type semiconductor package having the same | Hyunsoo Chung, Younglyong Kim | 2024-12-10 |
| 12154889 | Semiconductor package | Hyunsoo Chung, Taewon Yoo, Jinchan Ahn | 2024-11-26 |
| 12009328 | Semiconductor package and method of manufacturing the same | Hyunsoo Chung, Taewon Yoo | 2024-06-11 |
| 11705418 | Semiconductor package with conductive bump on conductive post including an intermetallic compound layer | Hyunsoo Chung, Taewon Yoo | 2023-07-18 |
| 11581234 | Semiconductor package with improved heat dissipation | Younglyong Kim, Aenee Jang | 2023-02-14 |
| 11488937 | Semiconductor package with stack structure and method of manufacturing the semiconductor package | Hyunsoo Chung, Younglyong Kim | 2022-11-01 |
| 11430772 | Semiconductor package | Hyunsoo Chung, Taewon Yoo | 2022-08-30 |
| 11362054 | Semiconductor package and method of manufacturing the same | Hyunsoo Chung, Taewon Yoo | 2022-06-14 |
| 11296004 | Semiconductor package including heat redistribution layers | Taewon Yoo, Hyunsoo Chung | 2022-04-05 |