Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388024 | Semiconductor package | Young Lyong Kim, Inhyo Hwang | 2025-08-12 |
| 12166013 | Semiconductor package, and a package on package type semiconductor package having the same | Younglyong Kim, Myungkee Chung | 2024-12-10 |
| 12159858 | Semiconductor package and method of fabricating the same | Young Lyong Kim, Inhyo Hwang | 2024-12-03 |
| 12154889 | Semiconductor package | Taewon Yoo, Myungkee Chung, Jinchan Ahn | 2024-11-26 |
| 12033948 | Semiconductor package | Young Lyong Kim, Inhyo Hwang | 2024-07-09 |
| 12009328 | Semiconductor package and method of manufacturing the same | Taewon Yoo, Myungkee Chung | 2024-06-11 |
| 11923292 | Semiconductor device and method of fabricating the same | Jinkuk Bae, Inyoung Lee, Donghyeon Jang | 2024-03-05 |
| 11705418 | Semiconductor package with conductive bump on conductive post including an intermetallic compound layer | Taewon Yoo, Myungkee Chung | 2023-07-18 |
| 11574819 | Semiconductor device and method for manufacturing the same | Chanho Lee, Hansung Ryu, Inyoung Lee | 2023-02-07 |
| 11488937 | Semiconductor package with stack structure and method of manufacturing the semiconductor package | Myungkee Chung, Younglyong Kim | 2022-11-01 |
| 11430772 | Semiconductor package | Taewon Yoo, Myungkee Chung | 2022-08-30 |
| 11362054 | Semiconductor package and method of manufacturing the same | Taewon Yoo, Myungkee Chung | 2022-06-14 |
| 11296004 | Semiconductor package including heat redistribution layers | Taewon Yoo, Myungkee Chung | 2022-04-05 |
| 11024575 | Semiconductor device and method of fabricating the same | Jinkuk Bae, Inyoung Lee, Donghyeon Jang | 2021-06-01 |
| 10937667 | Semiconductor device and method for manufacturing the same | Chanho Lee, Hansung Ryu, Inyoung Lee | 2021-03-02 |
| 10737191 | Assembly unit for toy assembly block | Seok-Bong Lee, Taikjin Lee, Jeong Hun Shin, Won Kyo JEONG, Sun Ho Kim +3 more | 2020-08-11 |
| 10699915 | Semiconductor device and method for manufacturing the same | Chanho Lee, Hansung Ryu, Inyoung Lee | 2020-06-30 |
| 10211070 | Semiconductor device and method for manufacturing the same | Chanho Lee, Hansung Ryu, Inyoung Lee | 2019-02-19 |
| 10188961 | Assembly unit for toy assembly block | Seok-Bong Lee, Taikjin Lee, Jeong Hun Shin, Won Kyo JEONG, Sun Ho Kim +3 more | 2019-01-29 |
| 9960112 | Semiconductor device | Chanho Lee, Myeong-Soon Park | 2018-05-01 |
| 9859204 | Semiconductor devices with redistribution pads | Myeong-Soon Park, Won Young Kim, Ae-Nee Jang, Chanho Lee | 2018-01-02 |
| 9853012 | Semiconductor packages having through electrodes and methods of fabricating the same | Jongyeon Kim, In-Young Lee, Tae-Je Cho | 2017-12-26 |
| 9508704 | Method of fabricating semiconductor package, semiconductor package formed thereby, and semiconductor device including the same | Inyoung Lee, Taeje Cho | 2016-11-29 |
| 9362172 | Semiconductor devices having through-vias and methods for fabricating the same | Kyu-Ha Lee, Ho-Jin Lee, Pil-Kyu Kang, Byung-Lyul Park, Gilheyun Choi | 2016-06-07 |
| 9355961 | Semiconductor devices having through-electrodes and methods for fabricating the same | Chajea Jo, Taeje Cho | 2016-05-31 |