Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230575 | Carrier structure including pockets for accommodating semiconductor chip stack structure | Woodong Lee, Insup Shin, Youngwoo Lim | 2025-02-18 |
| 12125753 | Semiconductor package including test bumps | Taehyeong Kim, Seungduk Baek | 2024-10-22 |
| 11756935 | Chip-stacked semiconductor package with increased package reliability | Insup Shin, Jungmin Ko, Hwanyoung Choi | 2023-09-12 |
| 11721601 | Semiconductor package and method of manufacturing the same | Jungmin Ko, Seungduk Baek, Taehyeong Kim, Insup Shin | 2023-08-08 |
| 11658160 | Semiconductor package and method of manufacturing the same | Hyeonjun Song, Eunkyul Oh, Jungmin Ko | 2023-05-23 |
| 11469099 | Semiconductor package with chip end design and trenches to control fillet spreading in stacked chip packages | Jungmin Ko, Sangsick Park, Hyeonjun Song | 2022-10-11 |
| 11257794 | Semiconductor package and method of manufacturing the same | Hyeonjun Song, Eunkyul Oh, Jungmin Ko | 2022-02-22 |
| 11257725 | Semiconductor package including test bumps | Taehyeong Kim, Seungduk Baek | 2022-02-22 |
| 9035308 | Semiconductor package and method of fabricating the same | Choongbin Yim, Taesung Park, Eunchul Ahn | 2015-05-19 |