Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756935 | Chip-stacked semiconductor package with increased package reliability | Insup Shin, Hyeongmun Kang, Jungmin Ko | 2023-09-12 |
HC
Hwanyoung Choi
Overall (All Time): #2,606,557 of 4,157,543Top 65%
1
Patents All Time