Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424582 | Semiconductor package including a plurality of semiconductor chips | Jungmin Ko, Taehyeong Kim, Youngwoo Lim, Dongki Choi | 2025-09-23 |
| 11658160 | Semiconductor package and method of manufacturing the same | Eunkyul Oh, Hyeongmun Kang, Jungmin Ko | 2023-05-23 |
| 11469099 | Semiconductor package with chip end design and trenches to control fillet spreading in stacked chip packages | Jungmin Ko, Hyeongmun Kang, Sangsick Park | 2022-10-11 |
| 11257794 | Semiconductor package and method of manufacturing the same | Eunkyul Oh, Hyeongmun Kang, Jungmin Ko | 2022-02-22 |