Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9035308 | Semiconductor package and method of fabricating the same | Choongbin Yim, Hyeongmun Kang, Taesung Park | 2015-05-19 |
| 8815731 | Semiconductor package and method of fabricating the same | Young Lyong Kim, Hyeongseob Kim, Jongho Lee | 2014-08-26 |
| 8759221 | Package substrates, semiconductor packages having the same, and methods of fabricating the semiconductor packages | Jin-Woo Park, Hwan-Sik Lim | 2014-06-24 |
| 8558400 | Semiconductor packages and methods of fabricating the same | Jin-Woo Park | 2013-10-15 |
| 8497569 | Package substrates and semiconductor packages having the same | Jin-Woo Park, Hwan-Sik Lim | 2013-07-30 |
| 8491982 | Apparatus for manufacturing bonding structure, bonding structure and method of fabricating the same | Yun-Rae Cho, Taesung Yoon, Youngmin Lee | 2013-07-23 |
| 8053881 | Semiconductor package and method for manufacturing the same | Young Lyong Kim, Jongho Lee, Cheul-Joong Youn | 2011-11-08 |