Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053881 | Semiconductor package and method for manufacturing the same | Young Lyong Kim, Jongho Lee, Eunchul Ahn | 2011-11-08 |
| 7495315 | Method and apparatus of fabricating a semiconductor device by back grinding and dicing | Sang-Yeop Lee | 2009-02-24 |
| 7323397 | Method and apparatus of fabricating a semiconductor device by back grinding and dicing | Sang-Yeop Lee | 2008-01-29 |
| 6984877 | Bumped chip carrier package using lead frame and method for manufacturing the same | Chan-Suk Lee | 2006-01-10 |