Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7023096 | Multi-chip package having spacer that is inserted between chips and manufacturing method thereof | Kyu Jin Lee | 2006-04-04 |
| 6736306 | Semiconductor chip package comprising enhanced pads | Kyu Jin Lee | 2004-05-18 |