Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5811875 | Lead frames including extended tie-bars, and semiconductor chip packages using same | Do Soo Jeong, Hai-Jeong Sohn | 1998-09-22 |
| 5808354 | Lead frame for a semiconductor device comprising inner leads having a locking means for preventing the movement of molding compound against the inner lead surface | Jin Hyuk Lee, Oh Sik Kwon | 1998-09-15 |
| 5744827 | Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements | Do Soo Jeong, Min Cheol An, Seung Ho Ahn, Ki-Won Choi | 1998-04-28 |
| 5581195 | Semiconductor chip holding device | Kyu Jin Lee | 1996-12-03 |
| 5468991 | Lead frame having dummy leads | Joon Ki LEE | 1995-11-21 |
| 5349235 | High density vertically mounted semiconductor package | Joon Ki LEE, Kyung Seob Kim, Oh Sik Kwon | 1994-09-20 |
| 5250840 | Semiconductor lead frame with a chip having bonding pads in a cross arrangement | Dong-Yean Oh, Heung-Kyu Kwon | 1993-10-05 |