Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6104095 | Printed circuit board and chip-on-board packages using same | Bo Hyun Shin | 2000-08-15 |
| 6028774 | Base cards and IC cards using the same | Bo Hyun Shin, Jung Hwan Cuun | 2000-02-22 |
| 5804874 | Stacked chip package device employing a plurality of lead on chip type semiconductor chips | Do Soo Jeong | 1998-09-08 |
| 5744827 | Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements | Do Soo Jeong, Seung Ho Ahn, Hyeon J. Jeong, Ki-Won Choi | 1998-04-28 |
| 5450289 | Semiconductor package and a printed circuit board applicable to its mounting | Yooung D. Kweon | 1995-09-12 |