Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7480776 | Circuits and methods for providing variable data I/O width for semiconductor memory devices | Han-Gu Sohn, Sei-jin Kim, Woo-Seop Jeong | 2009-01-20 |
| 6724074 | Stack semiconductor chip package and lead frame | Young-Hee Song, Ill-heung Choi, Sung Ho Hong | 2004-04-20 |
| 6573611 | Dual-lead type square semiconductor package and dual in-line memory module using the same | Jun-Young Jeon, Young-Hee Song | 2003-06-03 |
| 6319828 | Method for manufacturing a chip scale package having copper traces selectively plated with gold | Do Soo Jeong, Dong-Ho Lee | 2001-11-20 |
| D432096 | Semiconductor module | Jun-Young Jeon, Se-Yong Oh, Young-Hee Song | 2000-10-17 |
| D432097 | Semiconductor package | Young-Hee Song, Se-Yong Oh, Jun-Young Jeon | 2000-10-17 |
| 5933708 | Lead-on-chip semiconductor package and method for making the same | Sung-Min Sim, Young-Hee Song, Young Do Kweon | 1999-08-03 |
| 5811875 | Lead frames including extended tie-bars, and semiconductor chip packages using same | Do Soo Jeong, Hyeon J. Jeong | 1998-09-22 |
| 5428247 | Down-bonded lead-on-chip type semiconductor device | Young-Hee Song | 1995-06-27 |