Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8487452 | Semiconductor package having a stacked structure | Chan-Min Han, Kil-Soo Kim | 2013-07-16 |
| 7485006 | Memory module, socket and mounting method providing improved heat dissipating characteristics | Sang Wook Park, Joong-Hyun Baek, Hae-Hyung Lee, Hee-Kook Choi | 2009-02-03 |
| 7345882 | Semiconductor module with heat sink and method thereof | Hae-Hyung Lee, Sang Wook Park, Joong-Hyun Baek | 2008-03-18 |
| 7301233 | Semiconductor chip package with thermoelectric cooler | Hae-Hyung Lee, Sang Wook Park, Joong-Hyun Baek, Dong-Ho Lee | 2007-11-27 |
| 6835598 | Stacked semiconductor module and method of manufacturing the same | Joong-Hyun Baek, Yun-Hyeok Im, Tae-koo Lee | 2004-12-28 |