Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309280 | Semiconductor device package | Yong Hoon Kim, Kyung Suk Oh, Tae-Joo Hwang | 2022-04-19 |
| 11309300 | Semiconductor package including processor chip and memory chip | — | 2022-04-19 |
| 11205637 | Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics | Won Keun Kim, Kyung Suk Oh, Ji-Han Ko, Yeong Seok Kim, Joung Phil Lee +2 more | 2021-12-21 |
| 10797021 | Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics | Won Keun Kim, Kyung Suk Oh, Ji-Han Ko, Yeong Seok Kim, Joung Phil Lee +2 more | 2020-10-06 |
| 10727199 | Electronic device including semiconductor device package | Yong Hoon Kim, Kyung Suk Oh, Tae-Joo Hwang | 2020-07-28 |
| 10699983 | Semiconductor package | Yong Hoon Kim, Hyun Ki Kim, Kyung Suk Oh | 2020-06-30 |
| 9691737 | Semiconductor device | — | 2017-06-27 |
| 9299685 | Multi-chip package having a logic chip disposed in a package substrate opening and connecting to an interposer | — | 2016-03-29 |
| 9072525 | Combinable electrode needle base structure | Kyung Min Shin, Kyung Hoon SHIN, Dong Un Kim | 2015-07-07 |
| 8791580 | Integrated circuit packages having redistribution structures | Chul-Woo Park, Sun-Won Kang, Joong-Hyun Baek | 2014-07-29 |
| 8643175 | Multi-channel package and electronic system including the same | Sun-Pil Youn | 2014-02-04 |
| 8487452 | Semiconductor package having a stacked structure | Jin-Yang Lee, Chan-Min Han | 2013-07-16 |
| 8249023 | Packet switched radio telecommunication system supporting hard handover and method for hard handover | Sung Jin Suh | 2012-08-21 |
| 8018071 | Stacked structure using semiconductor devices and semiconductor device package including the same | — | 2011-09-13 |
| 7953043 | Packet switched radio telecommunication system supporting hard handover and method for hard handover | Sung Jin Suh | 2011-05-31 |
| 7064435 | Semiconductor package with improved ball land structure | Myung-Kee Chung, Min-Keun Kwak | 2006-06-20 |