JK

Ji-Han Ko

Samsung: 8 patents #15,984 of 75,807Top 25%
Overall (All Time): #631,950 of 4,157,543Top 20%
8
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11211273 Carrier substrate and packaging method using the same Wonkeun Kim 2021-12-28
11205637 Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics Won Keun Kim, Kyung Suk Oh, Kil-Soo Kim, Yeong Seok Kim, Joung Phil Lee +2 more 2021-12-21
10847473 Printed circuit boards with anti-warping molding portions and related semiconductor packages and methods of fabricating Bo Ram Kang, Dong Kwan Kim 2020-11-24
10797021 Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics Won Keun Kim, Kyung Suk Oh, Kil-Soo Kim, Yeong Seok Kim, Joung Phil Lee +2 more 2020-10-06
9177886 Semiconductor package including chip support and method of fabricating the same Woo-Dong Lee, Tae-Sung Park 2015-11-03
9171819 Semiconductor package Cheol Woo LEE 2015-10-27
8698300 Chip-stacked semiconductor package 2014-04-15
8508044 Semiconductor package, semiconductor device, and semiconductor module 2013-08-13