Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11615604 | Method and apparatus for measuring endolymphatic hydrops ratio of inner ear organ using artificial neural network | Won-Ho Chung, Baek Hwan Cho, Chae Jung Park | 2023-03-28 |
| 11205604 | Semiconductor package including a thermal conductive layer and method of manufacturing the same | Jae Choon Kim, Woo Hyun Park, Eon Soo Jang | 2021-12-21 |
| 10705155 | Memory systems and power management apparatuses including secondary power devices, and related methods of operation | Su-Yong An, Byung Ok Kang, Woo Sung Lee, Jae Woong Choi | 2020-07-07 |
| 10030496 | Method for producing synthetic gas by using solid acid | Hong Gon Kim, Min Jae KO, Ju Hee KIM, Jae Ik KIM, Kang Bong LEE +1 more | 2018-07-24 |
| 9356450 | Power supply circuits with discharge capability and methods of operating same | Sang-hun Jeon, Iksung Park | 2016-05-31 |
| 9129972 | Semiconductor package | Dong-Han Kim, Dae-Woo Son, Ye-Chung Chung | 2015-09-08 |
| 8952510 | Semiconductor chip and film and tab package comprising the chip and film | Chang-Sig Kang, Dae-Woo Son, Yun-Seok Choi, Kyong-Soon Cho, Sang-Heui Lee | 2015-02-10 |
| 8575735 | Semiconductor chip and film and TAB package comprising the chip and film | Chang-Sig Kang, Dae-Woo Son, Yun-Seok Choi, Kyong-Soon Cho, Sang-Heul Lee | 2013-11-05 |
| 8506703 | Method and apparatus for forming colloidal photonic crystals | Mi-jeong Song, Hong-seok Lee | 2013-08-13 |
| 8487437 | Electronic device package and method for fabricating the same | Peter Elenius, Deok-Hoon Kim | 2013-07-16 |
| 8434279 | Method for manufacturing a composite beam using T-type steel and method for constructing a structure using the same | Jeom Han Kim, Eun Ho Jeong, Kyoung Hun Lee | 2013-05-07 |
| 8222089 | Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same | Kyoung-Sei Choi, Byung-Seo Kim, Young-jae Joo, Ye-Chung Chung, Kyong-Soon Cho +6 more | 2012-07-17 |
| 8057598 | Manufacturing equipment for polysilicon ingot | Young Jo Kim | 2011-11-15 |
| 7915727 | Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same | Kyoung-Sei Choi, Byung-Seo Kim, Young-jae Joo, Ye-Chung Chung, Kyong-Soon Cho +6 more | 2011-03-29 |
| 7768103 | Tape distribution substrate having pattern for reducing EMI | Hee-Seok Lee | 2010-08-03 |
| 7589421 | Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same | Dong-Han Kim | 2009-09-15 |
| 7560805 | Semiconductor package and method of manufacturing the same | Na-Rae Shin | 2009-07-14 |
| 7508680 | Adjustable-inductance filter, tape distribution substrate comprising the filter, and display panel assembly comprising the tape distribution substrate | Hee-Seok Lee, Yun-Seok Choi, Eun-Seok Song, Na-Rae Shin | 2009-03-24 |
| 7350295 | Method of fabricating multi-layered printed circuit board for optical waveguides | Young Woo Kim, Dek-Gin Yang, Kyu-Hyok Yim | 2008-04-01 |
| 7197202 | Optical printed circuit board for long-distance signal transmission | Young Woo Kim, Byoung-Ho Rhee, Dek-Gin Yang, Kyu-Hyok Yim | 2007-03-27 |
| 7046870 | Method of fabricating multi-layered printed circuit board for optical waveguides | Young Woo Kim, Dek-Gin Yang, Kyu-Hyok Yim | 2006-05-16 |
| 7033457 | Method of attaching optical waveguide component to printed circuit board | Young Woo Kim, Dek-Gin Yang, Kyu-Hyok Yim | 2006-04-25 |
| 7025849 | Method of attaching optical waveguide component to printed circuit board | Young Woo Kim, Dek-Gin Yang, Kyu-Hyok Yim | 2006-04-11 |
| 6996305 | Printed circuit board with opto-via holes and process of forming the opto-via holes | Young Woo Kim, Dek-Gin Yang, Kyu-Hyok Yim | 2006-02-07 |
| 6978058 | Multi-layer PCB and method for coupling block type multichannel optical signals | Young Woo Kim, Byoung-Ho Rhee, Dek-Gin Yang, Kyu-Hyok Yim | 2005-12-20 |