Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8486318 | Fiber, fiber aggregate and adhesive having the same | Kyung Wook Paik, Kyoung Lim Suk, Jae-Ok Kim | 2013-07-16 |
| 8487437 | Electronic device package and method for fabricating the same | Peter Elenius, Young-Sang Cho | 2013-07-16 |
| 7494848 | Flip-chip packaging of a photo-sensor die on a transparent substrate | — | 2009-02-24 |
| 7384818 | Electronic package for image sensor, and the packaging method thereof | Hwan-Chul Lee | 2008-06-10 |
| 7291518 | Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof | — | 2007-11-06 |
| 7141869 | Electronic package for image sensor, and the packaging method thereof | Hwan-Chul Lee | 2006-11-28 |
| 7126164 | Wafer-level moat structures | Michael E. Johnson, Peter Elenius | 2006-10-24 |
| 7122874 | Electronic package having a sealing structure on predetermined area, and the method thereof | — | 2006-10-17 |
| 7038287 | Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof | John J. Reche | 2006-05-02 |
| 6943423 | Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof | — | 2005-09-13 |
| 6943424 | Electronic package having a patterned layer on backside of its substrate, and the fabrication thereof | — | 2005-09-13 |
| 6864116 | Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof | John J. Reche | 2005-03-08 |
| 6578755 | Polymer collar for solder bumps | Peter Elenius | 2003-06-17 |