Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8487437 | Electronic device package and method for fabricating the same | Deok-Hoon Kim, Young-Sang Cho | 2013-07-16 |
| 8141245 | Method of forming a circuit board with improved via design | Kevin C. Olson, Alan E. Wang, Thomas W. Goodman | 2012-03-27 |
| 7485812 | Single or multi-layer printed circuit board with improved via design | Kevin C. Olson, Alan E. Wang, Thomas W. Goodman | 2009-02-03 |
| 7126164 | Wafer-level moat structures | Michael E. Johnson, Deok-Hoon Kim | 2006-10-24 |
| 7118833 | Forming partial-depth features in polymer film | Michael E. Johnson | 2006-10-10 |
| 7057292 | Solder bar for high power flip chips | Hong Yang | 2006-06-06 |
| 6750135 | Method for forming chip scale package | Harry Hollack | 2004-06-15 |
| 6578755 | Polymer collar for solder bumps | Deok-Hoon Kim | 2003-06-17 |
| 6441487 | Chip scale package using large ductile solder balls | Harry Hollack | 2002-08-27 |
| 6287893 | Method for forming chip scale package | Harry Hollack | 2001-09-11 |
| 5838545 | High performance, low cost multi-chip modle package | Dennis Felix Clocher, Glenn G. Daves, Joseph John Lisowski, Joseph M. Sullivan | 1998-11-17 |
| 5397604 | Non-contact fluid applicator apparatus and method | Robert Phillips, III, Norman J. Dauerer, Brian M. Kerrigan, Helmut H. A. Krueger, Robert O. Lussow | 1995-03-14 |
| 5373893 | Method and apparatus for cooling thermally massive parts in a continuous furnace | David E. Eisenmann, James M. Leas, Wagih M. Wazni | 1994-12-20 |