| 8487437 |
Electronic device package and method for fabricating the same |
Deok-Hoon Kim, Young-Sang Cho |
2013-07-16 |
| 8141245 |
Method of forming a circuit board with improved via design |
Kevin C. Olson, Alan E. Wang, Thomas W. Goodman |
2012-03-27 |
| 7485812 |
Single or multi-layer printed circuit board with improved via design |
Kevin C. Olson, Alan E. Wang, Thomas W. Goodman |
2009-02-03 |
| 7126164 |
Wafer-level moat structures |
Michael E. Johnson, Deok-Hoon Kim |
2006-10-24 |
| 7118833 |
Forming partial-depth features in polymer film |
Michael E. Johnson |
2006-10-10 |
| 7057292 |
Solder bar for high power flip chips |
Hong Yang |
2006-06-06 |
| 6750135 |
Method for forming chip scale package |
Harry Hollack |
2004-06-15 |
| 6578755 |
Polymer collar for solder bumps |
Deok-Hoon Kim |
2003-06-17 |
| 6441487 |
Chip scale package using large ductile solder balls |
Harry Hollack |
2002-08-27 |
| 6287893 |
Method for forming chip scale package |
Harry Hollack |
2001-09-11 |
| 5838545 |
High performance, low cost multi-chip modle package |
Dennis Felix Clocher, Glenn G. Daves, Joseph John Lisowski, Joseph M. Sullivan |
1998-11-17 |
| 5397604 |
Non-contact fluid applicator apparatus and method |
Robert Phillips, III, Norman J. Dauerer, Brian M. Kerrigan, Helmut H. A. Krueger, Robert O. Lussow |
1995-03-14 |
| 5373893 |
Method and apparatus for cooling thermally massive parts in a continuous furnace |
David E. Eisenmann, James M. Leas, Wagih M. Wazni |
1994-12-20 |
