Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8141245 | Method of forming a circuit board with improved via design | Kevin C. Olson, Alan E. Wang, Peter Elenius | 2012-03-27 |
| 7485812 | Single or multi-layer printed circuit board with improved via design | Kevin C. Olson, Alan E. Wang, Peter Elenius | 2009-02-03 |
| 5519176 | Substrate and ceramic package | Hiroyuki Fujita, Yoshikazu Murakami, Arthur T. Murphy, Daniel Irwin Amey, Jr. | 1996-05-21 |
| 5477419 | Method and apparatus for electrically connecting an electronic part to a circuit board | Hiroyuki Fujita, Yoshikazu Murakami, Arthur T. Murphy | 1995-12-19 |