Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8629218 | Curable film-forming compositions containing ortho-hydroxyl aromatic functional acrylic polymers | Charles M. Kania, Lyle L. Foringer, Shiryn Tyebjee, Leigh Ann Humbert | 2014-01-14 |
| 8598467 | Multi-layer circuit assembly and process for preparing the same | Alan Wang | 2013-12-03 |
| 8563648 | Coating composition comprising an alkoxysilane, a polysiloxane, and a plurality of particles | Robert Schmeltzer, Susan F. Donaldson, Kurt G. Olson, John E. Schwendeman, Dennis A. Simpson +1 more | 2013-10-22 |
| 8409982 | Method of forming solid blind vias through the dielectric coating on high density interconnect (HDI) substrate materials | Alan E. Wang | 2013-04-02 |
| 8258411 | Printed circuit board with improved via design | Alan E. Wang | 2012-09-04 |
| 8141245 | Method of forming a circuit board with improved via design | Alan E. Wang, Peter Elenius, Thomas W. Goodman | 2012-03-27 |
| 8065795 | Multi-layer circuit assembly and process for preparing the same | Alan Wang | 2011-11-29 |
| 8008188 | Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials | Alan E. Wang | 2011-08-30 |
| 7803415 | Methods for coating food cans | Laura Kiefer-Liptak, John M. Dudik, Ronald R. Ambrose, Padmanabhan Sundararaman | 2010-09-28 |
| 7743494 | Process of fabricating a circuit board | Alan E. Wang, Michael J. Pawlik | 2010-06-29 |
| 7745508 | Compositions and methods for coating food cans | Laura Kiefer-Liptak, John M. Dudik, Ronald R. Ambrose, Padmanabhan Sundararaman | 2010-06-29 |
| 7690103 | Method of forming a printed circuit board with improved via design | Alan E. Wang | 2010-04-06 |
| 7679001 | Circuit board and method of manufacture thereof | Alan E. Wang, Thomas H. DiStefano | 2010-03-16 |
| 7666945 | Non-gelled curable compositions containing imide functional compositions | Gregory J. McCollum, Linda K. Anderson | 2010-02-23 |
| 7485812 | Single or multi-layer printed circuit board with improved via design | Alan E. Wang, Peter Elenius, Thomas W. Goodman | 2009-02-03 |
| 7294683 | Non-gelled curable compositions containing imide functional compounds | Gregory J. McCollum, Linda K. Anderson | 2007-11-13 |
| 7228623 | Process for fabricating a multi layer circuit assembly | Alan E. Wang | 2007-06-12 |
| 7159308 | Method of making a circuit board | Alan E. Wang, Thomas H. Di Stefano | 2007-01-09 |
| 7000313 | Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions | Gregory J. McCollum, Thomas C. Moriarity, Michael G. Sandala, Alan E. Wang, Steven R. Zawacky | 2006-02-21 |
| 7002081 | Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof | Alan E. Wang, Thomas H. Di Stefano | 2006-02-21 |
| 6951707 | Process for creating vias for circuit assemblies | Alan E. Wang | 2005-10-04 |
| 6844504 | Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof | Alan E. Wang, Thomas H. Di Stefano | 2005-01-18 |
| 6824959 | Process for creating holes in polymeric substrates | Alan E. Wang | 2004-11-30 |
| 6713587 | Electrodepositable dielectric coating compositions and methods related thereto | Gregory J. McCollum, Thomas C. Moriarity, Michael G. Sandala, Alan E. Wang, Craig A. Wilson +1 more | 2004-03-30 |
| 6671950 | Multi-layer circuit assembly and process for preparing the same | Lance C. Sturni | 2004-01-06 |