HH

Harry Hollack

FL Flip Chip Technologies, L.L.C.: 3 patents #2 of 5Top 40%
Overall (All Time): #1,604,816 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6750135 Method for forming chip scale package Peter Elenius 2004-06-15
6441487 Chip scale package using large ductile solder balls Peter Elenius 2002-08-27
6287893 Method for forming chip scale package Peter Elenius 2001-09-11