Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205604 | Semiconductor package including a thermal conductive layer and method of manufacturing the same | Jae Choon Kim, Eon Soo Jang, Young-Sang Cho | 2021-12-21 |
| 11004760 | Chip structure operating method including heating elements to reduce temperature variation | Jae Choon Kim | 2021-05-11 |
| 10964618 | Semiconductor package and method of manufacturing the same | Jang-woo Lee, Kyung Suk Oh, Yung-Cheol Kong, Jong Bo Shim, Jae-myeong Cha | 2021-03-30 |
| 10707196 | Electronic device and method of manufacturing the electronic device | Jae Choon Kim, Young-Deuk Kim | 2020-07-07 |
| 10553513 | Chip structure including heating element | Jae Choon Kim | 2020-02-04 |