Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406895 | Semiconductor device | Wonjung Jang | 2025-09-02 |
| 9640513 | Semiconductor package and method of fabricating the same | Seokhyun Lee, Jongho Lee | 2017-05-02 |
| 9627327 | Semiconductor package and method of manufacturing the same | Baik Woo Lee, Dong Hun Lee, Jae Gwon Jang | 2017-04-18 |
| 9570423 | Semiconductor package and method of manufacturing the semiconductor package | Young Lyong Kim, Ae-Nee Jang | 2017-02-14 |
| 9364914 | Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ball | Seokhyun Lee, Jaegwon Jang | 2016-06-14 |
| 9281235 | Semiconductor packages and methods of forming the same | Young Lyong Kim, Taehoon Kim, Jongho Lee | 2016-03-08 |
| 9245816 | Semiconductor package and method of manufacturing the semiconductor package | Young Lyong Kim, Ae-Nee Jang | 2016-01-26 |
| 9159705 | Semiconductor chip connecting semiconductor package | Ae-Nee Jang, Young Lyong Kim | 2015-10-13 |
| 8970046 | Semiconductor packages and methods of forming the same | Young Lyong Kim, Taehoon Kim, Jongho Lee | 2015-03-03 |
| 8846446 | Semiconductor package having buried post in encapsulant and method of manufacturing the same | Pyoung-Wan Kim, Teak-Hoon Lee | 2014-09-30 |
| 8344497 | Semiconductor package and electronic device having the same | Pyoung-Wan Kim, Eun-Chul Ahn, Teak-Hoon Lee | 2013-01-01 |
| 8154122 | Semiconductor package and methods of manufacturing the semiconductor package | Pyoung-Wan Kim, Teak-Hoon Lee | 2012-04-10 |
| 8093703 | Semiconductor package having buried post in encapsulant and method of manufacturing the same | Pyoung-Wan Kim, Teak-Hoon Lee | 2012-01-10 |
| 8008771 | Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device | Pyoung-Wan Kim, Eun-Chul Ahn, Jong Ho Lee, Teak-Hoon Lee | 2011-08-30 |
| 7898075 | Semiconductor package having resin substrate with recess and method of fabricating the same | Eun-Chul Ahn, Pyoung-Wan Kim, Taek-Hoon Lee | 2011-03-01 |
| 7807512 | Semiconductor packages and methods of fabricating the same | Teak-Hoon Lee, Pyoung-Wan Kim, Nam-Seog Kim | 2010-10-05 |
| 7759795 | Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same | Young Lyong Kim, Young-shin Choi, Jong Gi LEE, Kun-dae Yeom, Hyun Jong Woo | 2010-07-20 |