Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10966360 | Apparatus for combining printed circuit boards | Seul Ki Han, Myoun-Kyu Kang, Ki-Bong Mun, Du-San BAEK | 2021-03-30 |
| 8149404 | Method for aligning wafer and alignment apparatus using the method | Ki-Kwon Jeong | 2012-04-03 |
| 7759795 | Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same | Young Lyong Kim, Jong Gi LEE, Kun-dae Yeom, Chul-Yong Jang, Hyun Jong Woo | 2010-07-20 |