Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6358439 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 2002-03-19 |
| 6124041 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 2000-09-26 |
| 5925443 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 1999-07-20 |
| 5525761 | Copper-based paste containing refractory metal additions for densification control | Lawrence D. David, Shaji Farooq, Srinivasa S. N. Reddy, Rao V. Vallabhaneni | 1996-06-11 |
| 5512711 | Copper-based paste containing refractory metal additions for densification control | Lawrence D. David, Shaji Farooq, Srinivasa S. N. Reddy, Rao V. Vallabhaneni | 1996-04-30 |
| 5277725 | Process for fabricating a low dielectric composite substrate | John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more | 1994-01-11 |
| 5139852 | Low dielectric composite substrate | Arnold I. Baise, Ray M. Bryant, Jon A. Casey, Allen J. Dam, Werner E. Dunkel +4 more | 1992-08-18 |
| 5135595 | Process for fabricating a low dielectric composite substrate | John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more | 1992-08-04 |