| 6745932 |
Low strain chip removal apparatus |
Raschid J. Bezama, Govindarajan Natarajan |
2004-06-08 |
$6,083,000 |
| 6528145 |
Polymer and ceramic composite electronic substrates |
Daniel G. Berger, Shaji Farooq, Lester W. Herron, James N. Humenik, John U. Knickerbocker +2 more |
2003-03-04 |
$10,423,000 |
| 6509687 |
Metal/dielectric laminate with electrodes and process thereof |
Govindarajan Natarajan, Raschid J. Bezama, John U. Knickerbocker |
2003-01-21 |
$15,954,000 |
| 6459039 |
Method and apparatus to manufacture an electronic package with direct wiring pattern |
Raschid J. Bezama, Govindarajan Natarajan |
2002-10-01 |
$10,556,000 |
| 6423174 |
Apparatus and insertless method for forming cavity substrates using coated membrane |
Jon A. Casey, Govindarajan Natarajan, Vincent P. Peterson |
2002-07-23 |
$13,664,000 |
| 6395337 |
Substrate with ceramic coating for camber modification and method for making |
Raschid J. Bezama, Govindarajan Natarajan |
2002-05-28 |
$13,038,000 |
| 6332782 |
Spatial transformation interposer for electronic packaging |
Raschid J. Bezama, Govindarajan Natarajan |
2001-12-25 |
|
| 6319554 |
Method and apparatus for surface metallization |
Govindarajan Natarajan |
2001-11-20 |
$26,885,000 |
| 6319829 |
Enhanced interconnection to ceramic substrates |
Srinivasa S. N. Reddy, Rao V. Vallabhaneni |
2001-11-20 |
$26,885,000 |
| 5882455 |
Apparatus and method for forming isotropic multilayer ceramic substrates |
Raschid J. Bezama, Govindarajan Natarajan |
1999-03-16 |
$18,667,000 |
| 5788808 |
Apparatus for forming cavity substrates using compressive pads |
Govindarajan Natarajan, Charles H. Perry, Vincent P. Peterson |
1998-08-04 |
$10,071,000 |
| 5783026 |
Apparatus for stacking sheets by carriers |
Govindarajan Natarajan, John U. Knickerbocker |
1998-07-21 |
$12,143,000 |
| 5759320 |
Method of forming cavity substrates using compressive pads |
Govindarajan Natarajan, Charles H. Perry, Vincent P. Peterson |
1998-06-02 |
$5,806,000 |
| 5746874 |
Apparatus and method for forming cavity substrates using flexible preform insert |
Govindarajan Natarajan |
1998-05-05 |
$15,329,000 |
| 5315749 |
Method for holding substrates |
Anton Nenadic, Kenneth Furman |
1994-05-31 |
$5,696,000 |
| 5226636 |
Holding fixture for substrates |
Anton Nenadic, Kenneth Furman |
1993-07-13 |
$9,483,000 |
| 5084071 |
Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor |
Anton Nenadic |
1992-01-28 |
$23,396,000 |
| 4954142 |
Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor |
Jeffrey Carr, Lawrence D. David, William L. Guthrie, Frank B. Kaufman, William J. Patrick +2 more |
1990-09-04 |
$15,163,000 |
| RE32625 |
Dynamic testing of electrical conductors |
James A. Schwarz |
1988-03-15 |
|
| 4585672 |
Hydrogen charged thin film conductor |
James A. Schwarz |
1986-04-29 |
|
| 4525734 |
Hydrogen charged thin film conductor |
James A. Schwarz |
1985-06-25 |
|
| 4483629 |
Dynamic testing of electrical conductors |
James A. Schwarz |
1984-11-20 |
|
