Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor

Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor

US Patent 4954142 · Granted Sep 4, 1990

Estimated economic value: $15,163,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Compositions and methods for measuring bacterial growth2025
Self-radiated loopback test procedure for millimeter wave antennas2024
Sacrificial material facilitating protection of a substrate in a qubit device2024
Evaluation of wafer carcass alpha particle emission2024
Lithography for fabricating Josephson junctions2023
Self-radiated loopback test procedure for millimeter wave antennas2023
Qubits with ion implant Josephson junctions2022
Compositions and methods for measuring bacterial growth2022
Integrated reactive material erasure element with phase change memory2022
Reducing error rates with alpha particle protection2021
Heterogeneous miniaturization platform2021
Monolithic integration of III-V cells for powering memory erasure devices2021