WG

William L. Guthrie

Applied Materials: 11 patents #1,198 of 7,310Top 20%
IBM: 9 patents #11,918 of 70,183Top 20%
ST Sandisk Technologies: 4 patents #630 of 2,224Top 30%
HB Hgst Netherlands, B.V.: 1 patents #510 of 972Top 55%
Overall (All Time): #164,004 of 4,157,543Top 4%
25
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10101918 Systems and methods for generating hint information associated with a host command Judah Gamliel Hahn, Joseph Meza 2018-10-16
9824007 Data integrity enhancement to protect against returning old versions of data Girish Desai 2017-11-21
9817752 Data integrity enhancement to protect against returning old versions of data Girish Desai 2017-11-14
8949491 Buffer memory reservation techniques for use with a NAND flash memory Gary Lin, Robert Jackson, Yoav Weinberg, Girish Desai 2015-02-03
8364992 Method and system for reducing power consumption by command selection in a hard disk drive Nyles Heise, Hung M. Vu 2013-01-29
7255629 Polishing assembly with a window Manoocher Birang, Allan Gleason 2007-08-14
7118450 Polishing pad with window and method of fabricating a window in a polishing pad Manoocher Birang, Allan Gleason 2006-10-10
7011565 Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus Manoocher Birang, Allan Gleason 2006-03-14
6910944 Method of forming a transparent window in a polishing pad Manoocher Birang, Allan Gleason 2005-06-28
6632377 Chemical-mechanical planarization of metallurgy Vlasta Brusic, Daniel C. Edelstein, Paul M. Feeney, Mark A. Jaso, Frank B. Kaufman +4 more 2003-10-14
6280290 Method of forming a transparent window in a polishing pad Manoocher Birang, Allan Gleason 2001-08-28
6280297 Apparatus and method for distribution of slurry in a chemical mechanical polishing system Robert D. Tolles, Jeffrey Marks, Tsungnan Cheng 2001-08-28
6131271 Method of planarizing first pole piece layer of write head by lapping without delamination of first pole piece layer from wafer substrate Robert E. Fontana, Jr., Hung-Chin Guthrie, Eric James Lee, Li-Chung Lee, Francisco Martin 2000-10-17
6051499 Apparatus and method for distribution of slurry in a chemical mechanical polishing system Robert D. Tolles, Jeffrey Marks, Tsungnan Cheng, Semyon Spektor, Ivan A. Ocanada +1 more 2000-04-18
6045439 Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus Manoocher Birang, Allan Gleason 2000-04-04
6020264 Method and apparatus for in-line oxide thickness determination in chemical-mechanical polishing Naftali E. Lustig, Thomas E. Sandwick 2000-02-01
5893796 Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus Manoocher Birang, Allan Gleason 1999-04-13
5795215 Method and apparatus for using a retaining ring to control the edge effect Tsungnan Cheng, Sen-Hou Ko, Harry Q. Lee, Michael Sherwood, Norm Shendon 1998-08-18
5709593 Apparatus and method for distribution of slurry in a chemical mechanical polishing system Semyon Spektor, Ivan A. Ocanada, Norm Shendon 1998-01-20
5633195 Laser planarization of zone 1 deposited metal films for submicron metal interconnects Naftali E. Lustig 1997-05-27
5337015 In-situ endpoint detection method and apparatus for chemical-mechanical polishing using low amplitude input voltage Naftali E. Lustig, Randall M. Feenstra 1994-08-09
4954142 Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor Jeffrey Carr, Lawrence D. David, Frank B. Kaufman, William J. Patrick, Kenneth P. Rodbell +2 more 1990-09-04
4944836 Chem-mech polishing method for producing coplanar metal/insulator films on a substrate Klaus D. Beyer, Stanley R. Makarewicz, Eric Mendel, William J. Patrick, Kathleen Anne Perry +4 more 1990-07-31
4789648 Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias Melanie M. Chow, John Cronin, Carter W. Kaanta, Barbara Luther, William J. Patrick +2 more 1988-12-06
4702792 Method of forming fine conductive lines, patterns and connectors Ming-Fea Chow, Frank B. Kaufman 1987-10-27