Issued Patents All Time
Showing 25 most recent of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12403561 | Eddy current monitoring to detect vibration in polishing | Kun Xu, Patrick A. Higashi, Hassan G. Iravani, Haosheng Wu, Eric T. Wu +4 more | 2025-09-02 |
| 12370646 | Polishing apparatus using machine learning and compensation for pad thickness | Kun Xu, Denis Ivanov, Jun Qian | 2025-07-29 |
| 12136574 | Technique for training neural network for use in in-situ monitoring during polishing and polishing system | Kun Xu, Kiran Shrestha, Doyle E. Bennett, David Maxwell Gage, Benjamin Cherian +1 more | 2024-11-05 |
| 12057354 | Trained neural network in in-situ monitoring during polishing and polishing system | Kun Xu, Kiran Shrestha, Doyle E. Bennett, David Maxwell Gage, Benjamin Cherian +1 more | 2024-08-06 |
| 11865664 | Profile control with multiple instances of contol algorithm during polishing | Kun Xu, Benjamin Cherian, David Maxwell Gage | 2024-01-09 |
| 11850699 | Switching control algorithms on detection of exposure of underlying layer during polishing | Kun Xu, Benjamin Cherian, David Maxwell Gage | 2023-12-26 |
| 11791224 | Technique for training neural network for use in in-situ monitoring during polishing and polishing system | Kun Xu, Kiran Shrestha, Doyle E. Bennett, David Maxwell Gage, Benjamin Cherian +1 more | 2023-10-17 |
| 11780045 | Compensation for substrate doping for in-situ electromagnetic inductive monitoring | Wei Lu, David Maxwell Gage, Kun Xu, Jimin Zhang | 2023-10-10 |
| 11658078 | Using a trained neural network for use in in-situ monitoring during polishing and polishing system | Kun Xu, Kiran Shrestha, Doyle E. Bennett, David Maxwell Gage, Benjamin Cherian +1 more | 2023-05-23 |
| 11524382 | Polishing apparatus using machine learning and compensation for pad thickness | Kun Xu, Denis Ivanov, Jun Qian | 2022-12-13 |
| 10994389 | Polishing apparatus using neural network for monitoring | Kun Xu, Hassan G. Iravani, Denis Ivanov, Boguslaw A. Swedek, Shih-Haur Shen +1 more | 2021-05-04 |
| 10948900 | Display of spectra contour plots versus time for semiconductor processing system control | Jeffrey Drue David, Dominic J. Benvegnu, Boguslaw A. Swedek | 2021-03-16 |
| 10898986 | Chattering correction for accurate sensor position determination on wafer | Kun Xu, Jimin Zhang | 2021-01-26 |
| 9886026 | Endpoint method using peak location of spectra contour plots versus time | Jeffrey Drue David, Dominic J. Benvegnu, Boguslaw A. Swedek | 2018-02-06 |
| 9649743 | Dynamically tracking spectrum features for endpoint detection | Jeffrey Drue David | 2017-05-16 |
| 9607910 | Limiting adjustment of polishing rates during substrate polishing | Dominic J. Benvegnu, Benjamin Cherian, Sivakumar Dhandapani | 2017-03-28 |
| 9579767 | Automatic generation of reference spectra for optical monitoring of substrates | Jun Qian | 2017-02-28 |
| 9490186 | Limiting adjustment of polishing rates during substrate polishing | Dominic J. Benvegnu, Benjamin Cherian, Sivakumar Dhandapani | 2016-11-08 |
| 9482610 | Techniques for matching spectra | Kiran Shrestha, Boguslaw A. Swedek, Jeffrey Drue David | 2016-11-01 |
| 9375824 | Adjustment of polishing rates during substrate polishing with predictive filters | Dominic J. Benvegnu, Benjamin Cherian, Sivakumar Dhandapani | 2016-06-28 |
| 9346146 | Adjusting polishing rates by using spectrographic monitoring of a substrate during processing | Jeffrey Drue David, Dominic J. Benvegnu, Boguslaw A. Swedek | 2016-05-24 |
| 9296084 | Polishing control using weighting with default sequence | Jimin Zhang, Zhihong Wang, Wen-Chiang Tu | 2016-03-29 |
| 9289875 | Feed forward and feed-back techniques for in-situ process control | Jeffrey Drue David, Jun Qian | 2016-03-22 |
| 9283653 | Dynamically tracking spectrum features for endpoint detection | Jeffrey Drue David | 2016-03-15 |
| 9248544 | Endpoint detection during polishing using integrated differential intensity | Jimin Zhang, Zhihong Wang, Wen-Chiang Tu | 2016-02-02 |