Issued Patents All Time
Showing 25 most recent of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11240168 | System and method to exchange identity governance data across multiple identity repositories | James Darwin, David G. Kuehr-McLaren | 2022-02-01 |
| 10660239 | Cooling system with integrated fill and drain pump | Gary F. Goth, Daniel J. Kearney, Peter W. Kelly, Francis R. Krug, Jr., Robert K. Mullady +3 more | 2020-05-19 |
| 9918409 | Cooling system with integrated fill and drain pump | Gary F. Goth, Daniel J. Kearney, Peter W. Kelly, Francis R. Krug, Jr., Robert K. Mullady +3 more | 2018-03-13 |
| 9861013 | Cooling system with integrated fill and drain pump | Gary F. Goth, Daniel J. Kearney, Peter W. Kelly, Francis R. Krug, Jr., Robert K. Mullady +3 more | 2018-01-02 |
| 9743561 | Liquid-cooled heat sink configured to facilitate drainage | Frank M. Desiano, Robert K. Mullady, Donald W. Porter, Randy J. Zoodsma | 2017-08-22 |
| 9743562 | Liquid-cooled heat sink configured to facilitate drainage | Frank M. Desiano, Robert K. Mullady, Donald W. Porter, Randy J. Zoodsma | 2017-08-22 |
| 9537237 | System to improve an in-line memory module | Mark A. Brandon, Shawn Canfield, Robert R. Genest, Randall G. Kemink, Robert K. Mullady +1 more | 2017-01-03 |
| 9420728 | Liquid-cooled heat sink configured to facilitate drainage | Frank M. Desiano, Robert K. Mullady, Donald W. Porter, Randy J. Zoodsma | 2016-08-16 |
| 9021782 | Aerospace laser ignition/ablation variable high precision thruster | Jonathan Campbell, Jason Campbell | 2015-05-05 |
| 8582297 | Customized thermal interface to optimize mechanical loading and thermal conductivity characteristics | Randall G. Kemink, David C. Olson, Katie L. Pizzolato, John G. Torok | 2013-11-12 |
| 8531025 | Thermal paste containment for semiconductor modules | Sushumna Iruvanti, Hilton T. Toy, Wei Zou | 2013-09-10 |
| 8248805 | System to improve an in-line memory module | Mark A. Brandon, Shawn Canfield, Robert R. Genest, Randall G. Kemink, Robert K. Mullady +1 more | 2012-08-21 |
| 8046616 | Controlling power change for a semiconductor module to preserve thermal interface therein | — | 2011-10-25 |
| 8021925 | Thermal paste containment for semiconductor modules | Sushumna Iruvanti, Hilton T. Toy, Wei Zou | 2011-09-20 |
| 7900809 | Solder interconnection array with optimal mechanical integrity | Glenn G. Daves, Mukta G. Farooq, Frank L. Pompeo | 2011-03-08 |
| 7733655 | Lid edge capping load | Martin Beaumier, Mohamed Belazzouz, Peter J. Brofman, Kamal K. Sikka, Jiantao Zheng +1 more | 2010-06-08 |
| 7724527 | Method and structure to improve thermal dissipation from semiconductor devices | Patrick A. Coico, Richard F. Indyk, David C. Long | 2010-05-25 |
| 7709951 | Thermal pillow | William L. Brodsky, Peter J. Brofman, James A. Busby, Bruce J. Chamberlin, Scott Cummings +6 more | 2010-05-04 |
| 7687894 | IC chip package having automated tolerance compensation | John Saunders Corbin, Jr., David C. Long, Jason S. Miller | 2010-03-30 |
| 7518235 | Method and structure to provide balanced mechanical loading of devices in compressively loaded environments | Patrick A. Coico, Benjamin V. Fasano, Lewis S. Goldmann, Ellyn M. Ingalls, Michael S. June +2 more | 2009-04-14 |
| 7468886 | Method and structure to improve thermal dissipation from semiconductor devices | Patrick A. Coico, Richard F. Indyk, David C. Long | 2008-12-23 |
| 7464462 | Method of forming anisotropic heat spreading apparatus for semiconductor devices | Thomas J. Fleischman, Paul A. Zucco | 2008-12-16 |
| 7445141 | Solder interconnection array with optimal mechanical integrity | Glenn G. Daves, Mukta G. Farooq, Frank L. Pompeo | 2008-11-04 |
| 7440281 | Thermal interface apparatus | Sean Bailey, Richard Lidio Blanco, Jr., Supratik Guha, Michael D. Hillman, Yves Martin +6 more | 2008-10-21 |
| 7394666 | Circuit board cam-action standoff connector | Ronald L. Hering, David C. Long, Jason S. Miller, Carl R. Peterson | 2008-07-01 |