Issued Patents All Time
Showing 25 most recent of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11523519 | Fabricating an asymmetric printed circuit board with minimized warpage | Joseph Kuczynski, Paula M. Nixa | 2022-12-06 |
| 11178757 | Selective dielectric resin application on circuitized core layers | Matthew S. Kelly, Scott B. King, Joseph Kuczynski | 2021-11-16 |
| 11059120 | Non-destructive identifying of plating dissolution in soldered, plated through-hole | Matthew S. Kelly, Joseph Kuczynski, Scott B. King, Matthew S. Doyle | 2021-07-13 |
| 10982060 | Glass-free dielectric layers for printed circuit boards | Joseph Kuczynski, Jason T. Wertz, Sarah K. Czaplewski-Campbell, Jing Zhang | 2021-04-20 |
| 10959339 | Manufacturing a product using a soldering process | Andreas Huber, Harald Huels, Thomas-Michael Winkel | 2021-03-23 |
| 10932363 | Glass fiber coatings for improved resistance to conductive anodic filament formation | Matthew S. Kelly, Scott B. King, Joseph Kuczynski | 2021-02-23 |
| 10801137 | Glass cloth including attached fibers | Scott B. King, Joseph Kuczynski, David J. Russell | 2020-10-13 |
| 10768245 | Compliant pin with self sensing deformation | Matthew S. Kelly, Joseph Kuczynski, Scott B. King | 2020-09-08 |
| 10684220 | In-situ detection of glass fiber defects | Eric J. Campbell, Sarah K. Czaplewski, Scott B. King, Joseph Kuczynski | 2020-06-16 |
| 10674613 | Via stub elimination by disrupting plating | Joseph Kuczynski, Scott B. King, Matthew S. Kelly | 2020-06-02 |
| 10617014 | Via stub elimination by disrupting plating | Joseph Kuczynski, Scott B. King, Matthew S. Kelly | 2020-04-07 |
| 10590037 | Liquid immersion techniques for improved resistance to conductive anodic filament formation | Matthew S. Kelly, Scott B. King, Joseph Kuczynski | 2020-03-17 |
| 10578551 | In-situ detection of hollow glass fiber formation | Eric J. Campbell, Sarah K. Czaplewski, Scott B. King, Joseph Kuczynski | 2020-03-03 |
| 10492289 | Coating for limiting substrate damage due to discrete failure | Scott B. King, Joseph Kuczynski, David J. Russell | 2019-11-26 |
| 10470290 | Coating for limiting substrate damage due to discrete failure | Scott B. King, Joseph Kuczynski, David J. Russell | 2019-11-05 |
| 10462900 | Glass fiber coatings for improved resistance to conductive anodic filament formation | Matthew S. Kelly, Scott B. King, Joseph Kuczynski | 2019-10-29 |
| 10405421 | Selective dielectric resin application on circuitized core layers | Matthew S. Kelly, Scott B. King, Joseph Kuczynski | 2019-09-03 |
| 10342122 | Interface for limiting substrate damage due to discrete failure | Scott B. King, Joseph Kuczynski, David J. Russell | 2019-07-02 |
| 10212828 | Via stub elimination by disrupting plating | Joseph Kuczynski, Scott B. King, Matthew S. Kelly | 2019-02-19 |
| 10194537 | Minimizing printed circuit board warpage | Joseph Kuczynski, Paula M. Nixa | 2019-01-29 |
| 10172243 | Printed circuit board and methods to enhance reliability | Scott B. King, Joseph Kuczynski, David J. Russell | 2019-01-01 |
| 10149388 | Method for embedding a discrete electrical device in a printed circuit board | Andreas Huber, Harald Huels, Thomas Strach, Thomas-Michael Winkel | 2018-12-04 |
| 10080283 | Interface for limiting substrate damage due to discrete failure | Scott B. King, Joseph Kuczynski, David J. Russell | 2018-09-18 |
| 10010000 | Manufacturing a product using a soldering process | Andreas Huber, Harald Huels, Thomas-Michael Winkel | 2018-06-26 |
| 9986637 | Substrate containing low-Dk-core glass fibers having low dielectric constant (Dk) cores for use in printed circuit boards (PCBs), and method of making same | Joseph Kuczynski, Paula M. Nixa | 2018-05-29 |