Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10024606 | Fabricating thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s) | Amilcar R. Arvelo, Mark A. Brandon, Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever | 2018-07-17 |
| 9591787 | Selective clamping of electronics card to coolant-cooled structure | Amilcar R. Arvelo, Mark A. Brandon, Levi A. Campbell, Tan D. Doan, Michael J. Ellsworth, Jr. +1 more | 2017-03-07 |
| 9537237 | System to improve an in-line memory module | Mark A. Brandon, Shawn Canfield, David L. Edwards, Robert R. Genest, Robert K. Mullady +1 more | 2017-01-03 |
| 9341418 | Thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s) | Amilcar R. Arvelo, Mark A. Brandon, Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever | 2016-05-17 |
| 9258925 | Selective clamping of electronics card to coolant-cooled structure | Amilcar R. Arvelo, Mark A. Brandon, Levi A. Campbell, Tan D. Doan, Michael J. Ellsworth, Jr. +1 more | 2016-02-09 |
| 9144178 | Selective clamping of electronics card to coolant-cooled structure | Amilcar R. Arvelo, Mark A. Brandon, Levi A. Campbell, Tan D. Doan, Michael J. Ellsworth, Jr. +1 more | 2015-09-22 |
| 8582297 | Customized thermal interface to optimize mechanical loading and thermal conductivity characteristics | David L. Edwards, David C. Olson, Katie L. Pizzolato, John G. Torok | 2013-11-12 |
| 8274790 | Automatically reconfigurable liquid-cooling apparatus for an electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2012-09-25 |
| 8248805 | System to improve an in-line memory module | Mark A. Brandon, Shawn Canfield, David L. Edwards, Robert R. Genest, Robert K. Mullady +1 more | 2012-08-21 |
| 8125780 | In-line memory module cooling system | Gary F. Goth, Katie L. Pizzolato | 2012-02-28 |
| 7816785 | Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package | Sushumna Iruvanti, Rajneesh Kumar, Steven P. Ostrander, Prabjit Singh | 2010-10-19 |
| 7639498 | Conductive heat transport cooling system and method for a multi-component electronics system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2009-12-29 |
| 7408776 | Conductive heat transport cooling system and method for a multi-component electronics system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2008-08-05 |
| 7100281 | Heat sink and method of making the same | Prabjit Singh | 2006-09-05 |
| 6829145 | Separable hybrid cold plate and heat sink device and method | Joseph P. Corrado, Gary F. Goth, William P. Kostenko, Budy D. Notohardjono | 2004-12-07 |
| 6173759 | Method of cooling electronic devices using a tube in plate heat sink | George T. Galyon, Roger R. Schmidt | 2001-01-16 |
| 5826643 | Method of cooling electronic devices using a tube in plate heat sink | George T. Galyon, Roger R. Schmidt | 1998-10-27 |
| 5812372 | Tube in plate heat sink | George T. Galyon, Roger R. Schmidt | 1998-09-22 |
| 5794454 | Cooling device for hard to access non-coplanar circuit chips | Willard S. Harris, William D. McClafferty, Roger R. Schmidt | 1998-08-18 |
| 5699853 | Combined heat sink and sink plate | Gary F. Goth, John J. Loparco, Roger R. Schmidt | 1997-12-23 |