Issued Patents All Time
Showing 25 most recent of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10660239 | Cooling system with integrated fill and drain pump | David L. Edwards, Daniel J. Kearney, Peter W. Kelly, Francis R. Krug, Jr., Robert K. Mullady +3 more | 2020-05-19 |
| 9918409 | Cooling system with integrated fill and drain pump | David L. Edwards, Daniel J. Kearney, Peter W. Kelly, Francis R. Krug, Jr., Robert K. Mullady +3 more | 2018-03-13 |
| 9894807 | Changeable, airflow venting cover assembly for an electronics rack | Seth E. Bard, Frank E. Bosco, William P. Kostenko, Steven C. McIntosh, Robert K. Mullady +3 more | 2018-02-13 |
| 9861013 | Cooling system with integrated fill and drain pump | David L. Edwards, Daniel J. Kearney, Peter W. Kelly, Francis R. Krug, Jr., Robert K. Mullady +3 more | 2018-01-02 |
| 9639105 | Thermal management in a multi-phase power system | Robert Makowicki, Steven G. Shevach, Allan C. VanDeventer, Xiaojin Wei | 2017-05-02 |
| 9606562 | Thermal management in a multi-phase power system | Robert Makowicki, Steven G. Shevach, Allan C. VanDeventer, Xiaojin Wei | 2017-03-28 |
| 9313930 | Multi-level redundant cooling system for continuous cooling of an electronic system(s) | Francis R. Krug, Jr., Robert K. Mullady, Kevin P. Low, Allan C. VanDeventer, Randy J. Zoodsma | 2016-04-12 |
| 9313931 | Multi-level redundant cooling method for continuous cooling of an electronic system(s) | Francis R. Krug, Jr., Robert K. Mullady, Kevin P. Low, Allan C. VanDeventer, Randy J. Zoodsma | 2016-04-12 |
| 9273906 | Modular pumping unit(s) facilitating cooling of electronic system(s) | Francis R. Krug, Jr., Robert K. Mullady, Allan C. VanDeventer, Randy J. Zoodsma | 2016-03-01 |
| 8514575 | Multimodal cooling apparatus for an electronic system | William P. Kostenko, Robert K. Mullady, Allan C. VanDeventer | 2013-08-20 |
| 8385067 | In-line memory and circuit board cooling system | Amilcar R. Arvelo, Jason R. Eagle, Eric A. Eckberg, Katie L. Pizzolato, Scott A. Shurson | 2013-02-26 |
| 8125780 | In-line memory module cooling system | Randall G. Kemink, Katie L. Pizzolato | 2012-02-28 |
| 8018718 | Multiple chip module cooling system and method of operation thereof | Daniel J. Kearney, Paul M. Lucas, Donald W. Porter | 2011-09-13 |
| 7808783 | Multiple chip module cooling system and method of operation thereof | Daniel J. Kearney, Paul M. Lucas, Donald W. Porter | 2010-10-05 |
| 7803664 | Apparatus and methods for cooling semiconductor integrated circuit package structures | Evan G. Colgan, Deborah Sylvester, Jeffrey A. Zitz | 2010-09-28 |
| 7734444 | Systems and arrangements to assess thermal performance | Ronald Xavier Arroyo, Kenneth A. Bird, William A. Ciarfella, Bret P. Elison, Terrance Wayne Kueper +2 more | 2010-06-08 |
| 7715215 | Control of an AC-to-DC power supply assembly fed by a three-phase AC source | Frank E. Bosco, Kevin R. Covi, Anthony Joseph Cozzolino, Raymond J. Harrington, Peter Hein +3 more | 2010-05-11 |
| 7651890 | Method and apparatus for prevention of solder corrosion | William P. Kostenko, John J. Loparco, Prabjit Singh, John G. Torok | 2010-01-26 |
| 7394659 | Apparatus and methods for cooling semiconductor integrated circuit package structures | Evan G. Colgan, Deborah Sylvester, Jeffrey A. Zitz | 2008-07-01 |
| 7378603 | Enhanced blind-mated input/output card cassette packaging concept | John J. Loparco, Andrew Rybak, John G. Torok | 2008-05-27 |
| 7338818 | Systems and arrangements to assess thermal performance | Ronald Xavier Arroyo, Kenneth A. Bird, William A. Ciarfella, Bret P. Elison, Terrance Wayne Kueper +2 more | 2008-03-04 |
| 7119433 | Packaging for enhanced thermal and structural performance of electronic chip modules | John Saunders Corbin, Jr., Dales Morrison Kent, William P. Kostenko, Roger R. Schmidt, John G. Torok | 2006-10-10 |
| 7113401 | System for airflow management in electronic enclosures | Wiren D. Becker, Joseph P. Corrado, Ethan E. Cruz, Michael J. Fisher | 2006-09-26 |
| 7088583 | System for airflow management in electronic enclosures | Mark A. Brandon, Joseph P. Corrado, Ethan E. Cruz, Michael J. Fisher | 2006-08-08 |
| 6968709 | System and method for cooling multiple logic modules | Daniel J. Kearney, Kevin P. Low, Udo Meyer, Scott Barnett Swaney | 2005-11-29 |