Issued Patents All Time
Showing 51–63 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5977625 | Semiconductor package with low strain seal | Raed A. Sherif, Hilton T. Toy, Shaji Farooq, Patrick A. Coico | 1999-11-02 |
| 5931222 | Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same | Hilton T. Toy, Da-Yuan Shih, Ajay P. Giri | 1999-08-03 |
| 5891755 | Process for flat plate cooling a semiconductor chip using a thermal paste retainer | Sushumna Iruvanti, Gaetano P. Messina, Raed A. Sherif | 1999-04-06 |
| 5881944 | Multi-layer solder seal band for semiconductor substrates | Armando S. Cammarano, Jeffrey T. Coffin, Mark G. Courtney, Stephen S. Drofitz, Jr., Michael J. Ellsworth, Jr. +6 more | 1999-03-16 |
| 5881945 | Multi-layer solder seal band for semiconductor substrates and process | Armando S. Cammarano, Jeffrey T. Coffin, Mark G. Courtney, Stephen S. Drofitz, Jr., Michael J. Ellsworth, Jr. +6 more | 1999-03-16 |
| 5819402 | Method for cooling of chips using blind holes with customized depth | Mark G. Courtney, Albert Joseph Fahey, Gregory S. Hopper, Sushumna Iruvanti, Charles Frederick Jones +2 more | 1998-10-13 |
| 5821161 | Cast metal seal for semiconductor substrates and process thereof | James H. Covell, Lannie R. Bolde, Lewis S. Goldmann, Peter A. Gruber, Hilton T. Toy | 1998-10-13 |
| 5757620 | Apparatus for cooling of chips using blind holes with customized depth | Mark G. Courtney, Albert Joseph Fahey, Gregory S. Hopper, Sushumna Iruvanti, Charles Frederick Jones +2 more | 1998-05-26 |
| 5724729 | Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials | Raed A. Sherif, Mark G. Courtney, Albert Joseph Fahey, Gregory S. Hopper, Sushumna Iruvanti +2 more | 1998-03-10 |
| 5723905 | Semiconductor package with low strain seal | Patrick A. Coico, Shaji Farooq, Raed A. Sherif, Hilton T. Toy | 1998-03-03 |
| 5706171 | Flat plate cooling using a thermal paste retainer | Sushumna Iruvanti, Gaetano P. Messina, Raed A. Sherif | 1998-01-06 |
| 5623394 | Apparatus for cooling of chips using a plurality of customized thermally conductive materials | Raed A. Sherif, Mark G. Courtney, Albert Joseph Fahey, Gregory S. Hopper, Sushumna Iruvanti +2 more | 1997-04-22 |
| 5604978 | Method for cooling of chips using a plurality of materials | Raed A. Sherif, Mark G. Courtney, Albert Joseph Fahey, Gregory S. Hopper, Sushumna Iruvanti +2 more | 1997-02-25 |