Issued Patents All Time
Showing 26–50 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7376852 | Method for controlling power change for a semiconductor module | — | 2008-05-20 |
| 7328508 | Anisotropic heat spreading apparatus and method for semiconductor devices | Thomas J. Fleischman, Paul A. Zucco | 2008-02-12 |
| 7268428 | Thermal paste containment for semiconductor modules | Sushumna Iruvanti, Hilton T. Toy, Wei Zou | 2007-09-11 |
| 7250576 | Chip package having chip extension and method | Evan G. Colgan, Benjamin V. Fasano, Kamal K. Sikka, Jeffrey A. Zitz, Wei Zou | 2007-07-31 |
| 7239516 | Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip | David C. Long, Glenn G. Daves, Ronald L. Hering, Sushumna Iruvanti, Kenneth C. Marston +1 more | 2007-07-03 |
| 7086896 | Expandable standoff connector with slit collar and related method | Ronald L. Hering, David C. Long, Jason S. Miller | 2006-08-08 |
| 7079393 | Fluidic cooling systems and methods for electronic components | Evan G. Colgan, Frank L. Pompeo, Glenn G. Daves, Hilton T. Toy, Bruce K. Furman +7 more | 2006-07-18 |
| 6541365 | Insulating interposer between two electronic components and process thereof | Norman J. Dauerer, Glenn G. Daves | 2003-04-01 |
| 6451155 | Method using a thin adhesion promoting layer for bonding silicone elastomeric material to nickel and use thereof in making a heat sink assembly | Hilton T. Toy, Da-Yuan Shih, Ajay P. Giri | 2002-09-17 |
| 6444496 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof | Glenn G. Daves, Shaji Farooq, Sushumna Iruvanti, Frank L. Pompeo | 2002-09-03 |
| 6444082 | Apparatus and method for removing a bonded lid from a substrate | Barrie C. Campbell, Ronald L. Hering, Richard F. Shortt | 2002-09-03 |
| 6436223 | Process and apparatus for improved module assembly using shape memory alloy springs | Enrique C. Abreu, Ronald L. Hering, David C. Olson | 2002-08-20 |
| 6373133 | Multi-chip module and heat-sink cap combination | Giulio DiGiacomo, Stephen S. Drofitz, Jr., Larry D. Gross, Sushumna Iruvanti, Raed A. Sherif +4 more | 2002-04-16 |
| 6365977 | Insulating interposer between two electronic components and process thereof | Norman J. Dauerer, Glenn G. Daves | 2002-04-02 |
| 6294408 | Method for controlling thermal interface gap distance | Michael Emmett, Sushumna Iruvanti, Raed A. Sherif, Kamal K. Sikka, Hilton T. Toy | 2001-09-25 |
| 6291267 | Process for underfilling chip-under-chip semiconductor modules | Kevin A. Dore | 2001-09-18 |
| 6292369 | Methods for customizing lid for improved thermal performance of modules using flip chips | Glenn G. Daves | 2001-09-18 |
| 6275381 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof | Glenn G. Daves, Shaji Farooq, Sushumna Iruvanti, Frank L. Pompeo | 2001-08-14 |
| 6255139 | Method for providing a thermal path through particles embedded in a thermal cap | Patrick A. Coico, Sushumna Iruvanti, Frank L. Pompeo, Raed A. Sherif, Hilton T. Toy | 2001-07-03 |
| 6239484 | Underfill of chip-under-chip semiconductor modules | Kevin A. Dore | 2001-05-29 |
| 6214647 | Method for bonding heatsink to multiple-height chip | Giulio Di Giacomo, Stephen S. Drofitz, Jr., Sushumna Iruvanti, David J. Womac | 2001-04-10 |
| 6111314 | Thermal cap with embedded particles | Patrick A. Coico, Sushumna Iruvanti, Frank L. Pompeo, Raed A. Sherif, Hilton T. Toy | 2000-08-29 |
| 6091603 | Customizable lid for improved thermal performance of modules using flip chips | Glenn G. Daves | 2000-07-18 |
| 5982038 | Cast metal seal for semiconductor substrates | Hilton T. Toy, Lannie R. Bolde, James H. Covell, Lewis S. Goldmann, Peter A. Gruber | 1999-11-09 |
| 5981310 | Multi-chip heat-sink cap assembly | Giulio DiGiacomo, Stephen S. Drofitz, Jr., Larry D. Gross, Sushumna Iruvanti, Raed A. Sherif +4 more | 1999-11-09 |