GG

Giulio Di Giacomo

IBM: 1 patents #44,794 of 70,183Top 65%
📍 Hopewell Junction, NY: #439 of 648 inventorsTop 70%
🗺 New York: #67,335 of 115,490 inventorsTop 60%
Overall (All Time): #3,578,189 of 4,157,543Top 90%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6214647 Method for bonding heatsink to multiple-height chip Stephen S. Drofitz, Jr., David L. Edwards, Sushumna Iruvanti, David J. Womac 2001-04-10