| 6373133 |
Multi-chip module and heat-sink cap combination |
Giulio DiGiacomo, David L. Edwards, Larry D. Gross, Sushumna Iruvanti, Raed A. Sherif +4 more |
2002-04-16 |
| 6214647 |
Method for bonding heatsink to multiple-height chip |
Giulio Di Giacomo, David L. Edwards, Sushumna Iruvanti, David J. Womac |
2001-04-10 |
| 5990418 |
Hermetic CBGA/CCGA structure with thermal paste cooling |
Kevin G. Bivona, Jeffrey T. Coffin, Lewis S. Goldmann, Mario J. Interrante, Sushumna Iruvanti +1 more |
1999-11-23 |
| 5981310 |
Multi-chip heat-sink cap assembly |
Giulio DiGiacomo, David L. Edwards, Larry D. Gross, Sushumna Iruvanti, Raed A. Sherif +4 more |
1999-11-09 |
| 5881945 |
Multi-layer solder seal band for semiconductor substrates and process |
David L. Edwards, Armando S. Cammarano, Jeffrey T. Coffin, Mark G. Courtney, Michael J. Ellsworth, Jr. +6 more |
1999-03-16 |
| 5881944 |
Multi-layer solder seal band for semiconductor substrates |
David L. Edwards, Armando S. Cammarano, Jeffrey T. Coffin, Mark G. Courtney, Michael J. Ellsworth, Jr. +6 more |
1999-03-16 |
| 4272722 |
Determination of electric current flow patterns |
Armando S. Cammarano, Giulio DiGiacomo |
1981-06-09 |
