Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430710 | Lid/heat spreader having targeted flexibility | Shidong Li, Jay A. Bunt, Hilton T. Toy, Hongqing Zhang, David J. Lewison | 2022-08-30 |
| 11410905 | Optimized weight heat spreader for an electronic package | Kamal K. Sikka, Tuhin Sinha, Shidong Li | 2022-08-09 |
| 11164804 | Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste | Charles L. Arvin, Kevin Drummond, Luca Del Carro, Thomas J. Brunschwiler, Stephanie Allard +1 more | 2021-11-02 |
| 11152282 | Localized catalyst for enhanced thermal interface material heat transfer | Charles L. Arvin, Kevin Drummond, Chris Muzzy, Sushumna Iruvanti | 2021-10-19 |
| 10905029 | Cooling structure for electronic boards | Paul F. Bodenweber, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2021-01-26 |
| 10757833 | Cooling structure for electronic boards | Paul F. Bodenweber, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2020-08-25 |
| 10542636 | Cooling structure for electronic boards | Paul F. Bodenweber, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2020-01-21 |
| 10342160 | Heat sink attachment on existing heat sinks | Louis-Marie Achard, Janak G. Patel, David L. Questad | 2019-07-02 |
| 10172258 | Cooling structure for electronic boards | Paul F. Bodenweber, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2019-01-01 |
| 9883612 | Heat sink attachment on existing heat sinks | Louis-Marie Achard, Janak G. Patel, David L. Questad | 2018-01-30 |
| 9721870 | Cooling structure for electronic boards | Paul F. Bodenweber, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2017-08-01 |
| 9401315 | Thermal hot spot cooling for semiconductor devices | Paul F. Bodenweber, Taryn J. Davis, Marcus E. Interrante, Chenzhou Lian, Kathryn C. Rivera +2 more | 2016-07-26 |
| 9272498 | Precast thermal interface adhesive for easy and repeated, separation and remating | Evan G. Colgan, Paul W. Coteus, Michael A. Gaynes, Steven P. Ostrander | 2016-03-01 |
| 8772927 | Semiconductor package structures having liquid cooler integrated with first level chip package modules | Raschid J. Bezama, Evan G. Colgan, Michael A. Gaynes, John Harold Magerlein, Xiaojin Wei | 2014-07-08 |
| 8421217 | Achieving mechanical and thermal stability in a multi-chip package | Jon A. Casey, John Saunders Corbin, Jr., David Danovitch, Isabelle Depatie, Virendra R. Jadhav +4 more | 2013-04-16 |
| 8363404 | Implementing loading and heat removal for hub module assembly | John L. Colbert, Jason R. Eagle, Roger Duane Hamilton, Steven P. Ostrander | 2013-01-29 |
| 8268389 | Precast thermal interface adhesive for easy and repeated, separation and remating | Evan G. Colgan, Paul W. Coteus, Michael A. Gaynes, Steven P. Ostrander | 2012-09-18 |
| 8214658 | Enhanced thermal management for improved module reliability | Jon A. Casey, Michael Stephen Floyd, Soraya Ghiasi, Jennifer V. Muncy, Malcolm S. Ware +1 more | 2012-07-03 |
| 8202765 | Achieving mechanical and thermal stability in a multi-chip package | Jon A. Casey, John Saunders Corbin, Jr., David Danovitch, Isabelle Depatie, Virendra R. Jadhav +4 more | 2012-06-19 |
| 8115303 | Semiconductor package structures having liquid coolers integrated with first level chip package modules | Raschid J. Bezama, Evan G. Colgan, Michael A. Gaynes, John Harold Magerlein, Xiaojin Wei | 2012-02-14 |
| 7928562 | Segmentation of a die stack for 3D packaging thermal management | Amilcar R. Arvelo, Evan G. Colgan, John Harold Magerlein, Kathryn C. Rivera, Kamal K. Sikka +3 more | 2011-04-19 |
| 7917328 | Tracking thermal mini-cycle stress | Jon A. Casey, Michael Stephen Floyd, Soraya Ghiasi, Jennifer V. Muncy, Malcom S. Ware +1 more | 2011-03-29 |
| 7834442 | Electronic package method and structure with cure-melt hierarchy | Bruce K. Furman, Jiantao Zheng, Jeffrey A. Zitz | 2010-11-16 |
| 7808781 | Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements | Evan G. Colgan, Michael A. Gaynes, John Harold Magerlein, Roger R. Schmidt, Hilton T. Toy | 2010-10-05 |
| 7239516 | Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip | David C. Long, Glenn G. Daves, David L. Edwards, Ronald L. Hering, Sushumna Iruvanti +1 more | 2007-07-03 |