Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9456506 | Packaging for eight-socket one-hop SMP topology | Daniel M. Dreps, Paul M. Harvey, Rohan U. Mandrekar | 2016-09-27 |
| 9445507 | Packaging for eight-socket one-hop SMP topology | Daniel M. Dreps, Paul M. Harvey, Rohan U. Mandrekar | 2016-09-13 |
| 9265157 | Implementing heat sink loading having multipoint loading with actuation outboard of heatsink footprint | Jason R. Eagle, Roger Duane Hamilton | 2016-02-16 |
| 8958214 | Motherboard assembly for interconnecting and distributing signals and power | Arvind K. Sinha, Roger D. Weekly | 2015-02-17 |
| 8747122 | Implementing connection of two large electronic boards utilizing LGA interconnect | Terry Fredrick Banitt, Jason R. Eagle, Roger S. Krabbenhoft | 2014-06-10 |
| 8680670 | Multi-chip module system with removable socketed modules | Jon A. Casey, Paul M. Harvey, Mark K. Hoffmeyer, Charles L. Reynolds | 2014-03-25 |
| 8446738 | Motherboard assembly for interconnecting and distributing signals and power | Arvind K. Sinha, Roger D. Weekly | 2013-05-21 |
| 8363404 | Implementing loading and heat removal for hub module assembly | Jason R. Eagle, Roger Duane Hamilton, Kenneth C. Marston, Steven P. Ostrander | 2013-01-29 |
| 8267701 | Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing | Brian S. Beaman, William L. Brodsky, Mark K. Hoffmeyer, Yuet-Ying Yu | 2012-09-18 |
| 7985095 | Implementing enhanced connector guide block structures for robust SMT assembly | William L. Brodsky, Mark K. Hoffmeyer | 2011-07-26 |
| 7944698 | Mounting a heat sink in thermal contact with an electronic component | Eric A. Eckberg, Roger Duane Hamilton, Mark K. Hoffmeyer, Amanda E. Mikhail, Arvind K. Sinha | 2011-05-17 |
| 7903411 | Cold plate stability | Levi A. Campbell, Michael J. Ellsworth, Jr., Arvind K. Sinha | 2011-03-08 |
| 7777329 | Heatsink apparatus for applying a specified compressive force to an integrated circuit device | John Saunders Corbin, Jr., Jason R. Eagle, Roger Duane Hamilton, Amanda E. Mikhail, Arvind K. Sinha +1 more | 2010-08-17 |
| 7765693 | Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member | William L. Brodsky, Roger Duane Hamilton, Amanda E. Mikhail, Mark D. Plucinski | 2010-08-03 |
| 7751918 | Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates | Levi A. Campbell, Michael J. Ellsworth, Jr., Arvind K. Sinha | 2010-07-06 |
| 7731146 | Dual swivel in-line load node lock mechanism | Eric J. McKeever, John Allan Shurdalsvold, Daniel A. Wright | 2010-06-08 |
| 7701720 | Electronic assembly and techniques for installing a heatsink in an electronic assembly | John Saunders Corbin, Jr., Jason R. Eagle, Arvind K. Sinha, Christopher L. Tuma | 2010-04-20 |
| 7606033 | Mounting a heat sink in thermal contact with an electronic component | Eric A. Eckberg, Roger Duane Hamilton, Mark K. Hoffmeyer, Amanda E. Mikhail, Arvind K. Sinha | 2009-10-20 |
| 7550840 | Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof | Justin C. Rogers, Arvind K. Sinha | 2009-06-23 |
| 7517230 | Customizable backer for achieving consistent loading and engagement of array package connections | Mark K. Hoffmeyer | 2009-04-14 |
| 7499279 | Cold plate stability | Levi A. Campbell, Michael J. Ellsworth, Jr., Arvind K. Sinha | 2009-03-03 |
| 7486516 | Mounting a heat sink in thermal contact with an electronic component | Eric A. Eckberg, Roger Duane Hamilton, Mark K. Hoffmeyer, Amanda E. Mikhail, Arvind K. Sinha | 2009-02-03 |
| 7435622 | High performance reworkable heatsink and packaging structure with solder release layer and method of making | Mark K. Hoffmeyer | 2008-10-14 |
| 7399185 | Customizable backer for achieving consistent loading and engagement of array package connections | Mark K. Hoffmeyer | 2008-07-15 |
| 7345881 | Non-influencing fastener for mounting a heat sink in contact with an electronic component | John Saunders Corbin, Jr., Eric A. Eckberg, James D. Gerken, Roger Duane Hamilton, Maurice F. Holahan | 2008-03-18 |