Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Implementing connection of two large electronic boards utilizing LGA interconnect

Implementing connection of two large electronic boards utilizing LGA interconnect

US Patent 8747122 · Granted Jun 10, 2014

Estimated economic value: $4,765,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Alignment system and tool for visual inspection2025
Electronic component comprising first and second conductive traces and a void fo2025
Method to manufacture conductive anodic filament-resistant microvias2024
Distributing heatsink load across a processor module with separable input/output2023
Processor module retention2023
Fixture facilitating heat sink fabrication2022
Implementing modular baffling mechanism for selectively redirecting and impeding2022
Fixture facilitating heat sink fabrication2021
Off the module cable assembly2021
Integrated circuit device assembly2020
High speed chip substrate test fixture2020
Insertion loss reduction and increased bonding in a circuit apparatus2020