| 6802733 |
Topside installation apparatus for land grid array modules |
John L. Colbert, John Saunders Corbin, Jr., Roger Duane Hamilton, Arvind K. Sinha |
2004-10-12 |
| 6757965 |
Method of installing a land grid array multi-chip modules |
John L. Colbert, John Saunders Corbin, Jr., Roger Duane Hamilton, Arvind K. Sinha, Charles C. Stratton |
2004-07-06 |
| 6634095 |
Apparatus for mounting a land grid array module |
John L. Colbert, John Saunders Corbin, Jr., Roger Duane Hamilton, Arvind K. Sinha, Charles C. Stratton |
2003-10-21 |
| 6475011 |
Land grid array socket actuation hardware for MCM applications |
Arvind K. Sinha, Roger Duane Hamilton, John L. Colbert, John Saunders Corbin, Jr. |
2002-11-05 |
| 6449155 |
Land grid array subassembly for multichip modules |
John L. Colbert, John Saunders Corbin, Jr., Roger Duane Hamilton, Arvind K. Sinha |
2002-09-10 |
| 6385044 |
Heat pipe heat sink assembly for cooling semiconductor chips |
John L. Colbert, John Saunders Corbin, Jr., Roger Duane Hamilton, Arvind K. Sinha |
2002-05-07 |
| 5770891 |
Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer |
Richard F. Frankeny, Jerome A. Frankeny, Keith A. Vanderlee |
1998-06-23 |
| 5738531 |
Self-alligning low profile socket for connecting ball grid array devices through a dendritic interposer |
Daniel Paul Beaman, John Saunders Corbin, Jr. |
1998-04-14 |
| 5691041 |
Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer |
Richard F. Frankeny, Jerome A. Frankeny, Keith A. Vanderlee |
1997-11-25 |
