Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6802733 | Topside installation apparatus for land grid array modules | John L. Colbert, John Saunders Corbin, Jr., Roger Duane Hamilton, Arvind K. Sinha | 2004-10-12 |
| 6757965 | Method of installing a land grid array multi-chip modules | John L. Colbert, John Saunders Corbin, Jr., Roger Duane Hamilton, Arvind K. Sinha, Charles C. Stratton | 2004-07-06 |
| 6634095 | Apparatus for mounting a land grid array module | John L. Colbert, John Saunders Corbin, Jr., Roger Duane Hamilton, Arvind K. Sinha, Charles C. Stratton | 2003-10-21 |
| 6475011 | Land grid array socket actuation hardware for MCM applications | Arvind K. Sinha, Roger Duane Hamilton, John L. Colbert, John Saunders Corbin, Jr. | 2002-11-05 |
| 6449155 | Land grid array subassembly for multichip modules | John L. Colbert, John Saunders Corbin, Jr., Roger Duane Hamilton, Arvind K. Sinha | 2002-09-10 |
| 6385044 | Heat pipe heat sink assembly for cooling semiconductor chips | John L. Colbert, John Saunders Corbin, Jr., Roger Duane Hamilton, Arvind K. Sinha | 2002-05-07 |
| 5770891 | Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer | Richard F. Frankeny, Jerome A. Frankeny, Keith A. Vanderlee | 1998-06-23 |
| 5738531 | Self-alligning low profile socket for connecting ball grid array devices through a dendritic interposer | Daniel Paul Beaman, John Saunders Corbin, Jr. | 1998-04-14 |
| 5691041 | Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer | Richard F. Frankeny, Jerome A. Frankeny, Keith A. Vanderlee | 1997-11-25 |