Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11811335 | Contact pad with electrical connection structure for connecting a piezoelectric element and an electrical circuit with a conductive adhesive | Kuen Chee Ee, Peter Hahn, David Glaess | 2023-11-07 |
| 11348608 | Tri-stage design for actuator attachment on flexure | Peter Hahn, David Glaess, Kuen Chee Ee, Benjapa Tanampee, Preecha Sudachun +1 more | 2022-05-31 |
| 11121647 | Contact pad features | Kuen Chee Ee, Peter Hahn, David Glaess | 2021-09-14 |
| 10332552 | Disk drive suspension having stamped base plate distal tip | — | 2019-06-25 |
| 10276195 | Head suspension assembly having PZT damper | Kuen Chee Ee, Long Zhang | 2019-04-30 |
| 10032466 | Suspension vibration damper with internal metal layer | — | 2018-07-24 |
| 9892748 | Head suspension assembly having PZT damper with non-uniform thickness | Kuen Chee Ee, Long Zhang | 2018-02-13 |
| 9837109 | Disk drive suspension having stamped base plate distal tip | — | 2017-12-05 |
| 8320083 | Electrical interconnect with improved corrosion resistance for a disk drive head suspension | Christopher Dunn | 2012-11-27 |
| 8085506 | Disk drive gimbal having a stable pitch static attitude and related method of manufacture | Kuen Chee Ee, Christopher Dunn, Peter Hahn | 2011-12-27 |
| 5770891 | Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer | Richard F. Frankeny, Jerome A. Frankeny, Danny E. Massey | 1998-06-23 |
| 5691041 | Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer | Richard F. Frankeny, Jerome A. Frankeny, Danny E. Massey | 1997-11-25 |
| 5600259 | Method and apparatus for reducing interference in a pin array | Bernd Bartyzel, Steven A. Duncan, Daniel A. Fields | 1997-02-04 |
| 5509200 | Method of making laminar stackable circuit board structure | Jerome A. Frankeny, Richard F. Frankeny, Ronald L. Imken | 1996-04-23 |
| 4774760 | Method of making a multipad solder preform | Ronald J. Seaman | 1988-10-04 |