| 9609744 |
Area array device connection structures with complimentary warp characteristics |
Mark K. Hoffmeyer, Arvind K. Sinha |
2017-03-28 |
$2,520,000 |
| 9247636 |
Area array device connection structures with complimentary warp characteristics |
Mark K. Hoffmeyer, Arvind K. Sinha |
2016-01-26 |
$2,109,000 |
| 9090004 |
Composites comprised of aligned carbon fibers in chain-aligned polymer binder |
Joseph Kuczynski, Arden L. Moore |
2015-07-28 |
$3,451,000 |
| 8275575 |
Determining component failure rates using accelerated life data |
Mark D. Plucinski |
2012-09-25 |
$5,997,000 |
| 8007291 |
Implementing differential signal circuit board electrical contact |
Don A. Gilliland, Joseph Kuczynski |
2011-08-30 |
$4,619,000 |
| 7975379 |
Method of making a land-grid-array (LGA) interposer |
Gareth G. Hougham, Brian S. Beaman, John Saunders Corbin, Jr., Paul W. Coteus, Shawn A. Hall +3 more |
2011-07-12 |
$4,098,000 |
| 7944698 |
Mounting a heat sink in thermal contact with an electronic component |
John L. Colbert, Eric A. Eckberg, Roger Duane Hamilton, Mark K. Hoffmeyer, Arvind K. Sinha |
2011-05-17 |
$5,524,000 |
| 7849592 |
Method of compensating for thermal expansion in SMT interconnects |
William L. Brodsky |
2010-12-14 |
$5,212,000 |
| 7777329 |
Heatsink apparatus for applying a specified compressive force to an integrated circuit device |
John L. Colbert, John Saunders Corbin, Jr., Jason R. Eagle, Roger Duane Hamilton, Arvind K. Sinha +1 more |
2010-08-17 |
$4,695,000 |
| 7765693 |
Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member |
William L. Brodsky, John L. Colbert, Roger Duane Hamilton, Mark D. Plucinski |
2010-08-03 |
$4,325,000 |
| 7632127 |
Socket and method for compensating for differing coefficients of thermal expansion |
Brian S. Beaman, Joseph Kuczynski, Theron Lee Lewis, Arvind K. Sinha |
2009-12-15 |
$28,418,000 |
| 7606033 |
Mounting a heat sink in thermal contact with an electronic component |
John L. Colbert, Eric A. Eckberg, Roger Duane Hamilton, Mark K. Hoffmeyer, Arvind K. Sinha |
2009-10-20 |
$15,311,000 |
| 7530853 |
Socket and method for compensating for differing coefficients of thermal expansion |
Brian S. Beaman, Joseph Kuczynski, Theron Lee Lewis, Arvind K. Sinha |
2009-05-12 |
$9,410,000 |
| 7489224 |
Ferrite core, and flexible assembly of ferrite cores for suppressing electromagnetic interference |
Jessica Berens, Don Gilliland |
2009-02-10 |
$5,620,000 |
| 7488192 |
Apparatus and method that minimizing dimensional instability and solder stress in surface mounted interconnections |
Jason R. Eagle, Joseph Kuczynski, Christopher M. Marroquin |
2009-02-10 |
$5,620,000 |
| 7486516 |
Mounting a heat sink in thermal contact with an electronic component |
John L. Colbert, Eric A. Eckberg, Roger Duane Hamilton, Mark K. Hoffmeyer, Arvind K. Sinha |
2009-02-03 |
$3,057,000 |
| 7472477 |
Method for manufacturing a socket that compensates for differing coefficients of thermal expansion |
Brian S. Beaman, Joseph Kuczynski, Theron Lee Lewis, Arvind K. Sinha |
2009-01-06 |
$2,860,000 |
| 7442053 |
Apparatus for restricting rotational moment about a longitudinal axis of SMT connectors |
William L. Brodsky, Mark G. Clark, Arvind K. Sinha, Scott A. Shurson, Jason T. Stoll |
2008-10-28 |
$6,235,000 |
| 7396244 |
Apparatus for extracting and inserting a DIMM |
Kyle Steven Barna, William L. Brodsky, John G. Torok |
2008-07-08 |
$9,414,000 |
| 7393244 |
Method and apparatus for restricting rotational moment about a longitudinal axis of SMT connectors |
William L. Brodsky, Scott A. Shurson |
2008-07-01 |
$7,630,000 |
| 7354281 |
Method and apparatus for restricting rotational moment about a longitudinal axis of SMT connectors |
William L. Brodsky, Mark G. Clark, Arvind K. Sinha, Scott A. Shurson, Jason T. Stoll |
2008-04-08 |
$6,866,000 |
| 7303443 |
Socket and method for compensating for differing coefficients of thermal expansion |
Brian S. Beaman, Joseph Kuczynski, Theron Lee Lewis, Arvind K. Sinha |
2007-12-04 |
$7,765,000 |
| 7293994 |
Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member |
William L. Brodsky, John L. Colbert, Roger Duane Hamilton, Mark D. Plucinski |
2007-11-13 |
$7,366,000 |
| 7140884 |
Contact assembly and method of making thereof |
William L. Brodsky |
2006-11-28 |
$5,022,000 |
| 7138896 |
Ferrite core, and flexible assembly of ferrite cores for suppressing electromagnetic interference |
Jessica Berens, Don A. Gilliland |
2006-11-21 |
$6,127,000 |
